SELA - Semiconductor Engineering Laboratories Ltd.

www.sela.com

High-Tech Company

Acquired by Camtek

TECH VERTICALS

Computer Vision, Machine Vision, Nanotechnology, Testing

General Data

Sector	Semiconductors
Company Stage:	Initial Revenues
Established	1992
Number of Employees	26
Reg. Number:	abCDe

DESCRIPTION

SELA develops and manufactures yield enhancement and automation equipment for the semiconductor industry, including automated SEM (scanning electron microscope) and TEM (transmission electron microscope) sample preparation equipment, based on patented, globally recognized technologies. Sela’s proprietary Microcleaving technology and the AIM (Adaptive Ion Milling) technology set the standard for high quality, automated engineering and failure analysis sample preparation.

TECHNOLOGY

Optimal cross-sectioning technology for use in fault analysis or process monitoring is an industry requirement, necessary to improving overall process yield. The innovative Micro Cleaving system appears to b a unique, viable tool that overcomes the limitations inherent in existing cross-sectioning methods.

SELA EM3 - a dedicated, automated, timesaving and user-friendly system that enables a total solution for TEM/STEM and SEM sample preparation for both cross section and plan view in a wide range of applications. Featuring a cryo-cooled, dry sawing process, the EM3 system prepares specimens of either crystalline or amorphous materials. The output sample is mounted onto a compatible stub or standard TEM grid that allows rework.

SELA MC600 - The MC600 system achieves fully automatic, reliable and rapid cross-sectioning of whole and partial wafers. Dedicated software enables automatic mapping and navigating to targets, and features automatic off-loading for immediate inspection. These features, together with high throughput (9 min/sample), high accuracy (less than 0.5 micron), and the excellent quality of the cross-sections produced, significantly reduce the diagnostic cycle for both failure analysis and process monitoring.

SELA MC600i - The MC600i is an enhanced version of the award-winning MC600 Microcleaving system. In addition to all the features of the MC600, the MC600i offers increased accuracy, enables cleaving of smaller wafer segments and dies and allows cleaving as close as 0.5mm to a sample edge.

The MC600i system achieves full automatic, reliable and rapid cross sectioning of wafer segments and dies. Dedicated software enables automatic mapping and navigating to targets, and features automatic off-loading for immediate inspection. These features, together with high throughput (9 min/sample), high accuracy (less than 0.3 micron), and the excellent quality of the cross-sections produced, significantly reduce the diagnostic cycle for both failure analysis and process monitoring.

SELA Xact - the first TEM sample preparation system using the disruptive new AIMTM technology, delivering significantly reduced turnaround times and enhanced productivity. AIMTM, SELA's unique Adaptive Ion Milling technology, is superior to the traditional Focused Ion Beam technology (FIB). AIMTM can reduce sample widths to below 50 nanometers over a large area with high precision, artifact free (wedge-like) quality, and higher throughput.
SELA’s newest system, Xact, introduces a twin-beam combination uniquely configured for more precise end-point detection and artifact-free sample clarity. The Xact joins SELA's SEM-oriented Microcleaving solution to set the standard for high-quality, automated engineering and failure analysis EM sample preparation.
The Xact and SELA’s latest pre-preparation standalone system – the EM3 – offers a comprehensive and cost effective solution for TEM and STEM sample preparation. The division of functions, pre-prep and final prep, between two standalone and optimized tools enables parallel processing for the highest total productivity. It also results in a low cost per sample and, more importantly, a low cost per successful sample given the success rate of preparation resulting from enhanced quality, large area and end-point detection.

ESTIMATED ANNUAL SALES

	TARGET MARKETS
	Fabs, Equipment and Material Suppliers, Research Institutes, semiconductor manufacturers.

	BUSINESS MODEL
	B2B

SERVICE PROVIDERS

Company Name	Type
abC Defghij	Patent Attorneys
abC Defghij	Accounting Firm
abC Defghij	Law Firm

CONTACT INFO

Expand / Collapse All

Main Address: Yoqneam Ilit, Israel

Address	Sultam Industrial Zone, Tavor Bldg., Entrance No.3, 2nd Floor
POB	95
City	Yoqneam Ilit
Country	Israel
Zip	20692

Contact Person	abC Defghij
Contact E-Mail	abC Defghij
Company E-mail	abC Defghij
Telephone	abC Defghij
Fax	abC Defghij

Branch Address: Santa Clara, United States

Address	2045 Martin Ave., Suite 206
City	Santa Clara
State/Province	CA
Country	United States
Zip	95050

Contact Person	abC Defghij
Contact E-Mail	abC Defghij
Company E-mail	abC Defghij
Telephone	abC Defghij
Fax	abC Defghij

	MANAGEMENT

Key Executive

Name	Title
Mr. Colin Smith	President & CEO
Dr. Zvi Meiri	Founder

	BOARD

Board

Member	Title	Affiliation
abC Defghij	Board Member	President & CEO, RDC
abC Defghij	Board Member	President, SELA

Mergers & Acquisitions

Round

Date

Stage

Amount

Valuation

Acquired

Sep. 24, 2009

abCDe

	FINANCIAL ROUNDS

Total Capital Raised
abCDe

Financial Rounds

Numbers of Investors

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Round

Date

Stage

Amount

Valuation

Third Round

Aug. 01, 2007

Revenue Growth

abCDe

* New investor

Investor	Type	Amount	Remarks
abC Defghij	Angel Club/ Group	abCDe
abC Defghij	Holding Company	abCDe
abC Defghij	Investment Company	abCDe

Internal Round

May. 01, 2005

Initial Revenues

abCDe

* New investor

Investor	Type	Amount	Remarks
abC Defghij	Holding Company	abCDe	Holds 54.4% of the company

Second Round

Aug. 06, 2001

Initial Revenues

abCDe

First Round

Jan. 01, 1998

R&D

abCDe

* New investor

Investor	Type	Amount	Remarks
abC Defghij	Venture Capital Fund	abCDe	Holds 1.3% of the company
abC Defghij	Angel Club/ Group	abCDe
abC Defghij	Holding Company	abCDe	Merged into Rafael
abC Defghij	Holding Company	abCDe
abC Defghij	Investment Company	abCDe	Holds 17% of the company directly

Other

Jan. 01, 1998

abCDe

	R&D Grants

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Round

Date

Stage

Amount

Remarks

R&D Grant

abCDe

* New investor

Investor	Type	Amount	Remarks
abC Defghij	Government Agency	abCDe	R&D grant

Last Updated:	abCDe
IVC Number:	abCDe